Based on the ZigBee specification, the MC1322x PiP (Platform in Package) solution is engineered to support a battery life of up to 20 years, doubling the expectations for current ZigBee solutions. It contains a 32-bit microcontroller capable of running at up to 26MHz, a fully compliant IEEE 802.15.4 transceiver, dual 12-bit ADCs, balun and RF-matching components, all integrated into a small-footprint land-grid array package that virtually eliminates the need for external RF components. The platform solution also features a TurboLink technology mode, engineered to increase data rates by up to 2Mbit/s between nodes. The MC1322x devices automatically switch between the IEEE 802.15.4 protocol and TurboLink technology packets, allowing the developer to take advantage of the high-speed capabilities while simultaneously controlling and monitoring a ZigBee mesh network. The MC1322x device comes in two package options: a 9.5x9.5mm LGA and a 7x7mm QFN.