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Thermal-Management Material
has a thermal conductivity of 1.5W/m.K
01/08/2007
Reference: 23252

Offering a thermal performance 3.5 times better than epoxy glass-on-aluminium alternatives, the Bond-Ply TCP-1000 dielectric material can easily be processed by most PCB shops with standard multilayer vacuum-lamination equipment. The material is suitable for applications using high-brightness LEDs, reducing the risks of over-heating. The Bond-Ply TCP-1000 comes in the form of a metal core PCB with an aluminium-base layer in standard thicknesses of 1.0 and 1.6mm. The circuit-foil version is available in 35 and 70µm; other foil thicknesses are available upon request. Laminated panels are available in 457x609mm and 508x609mm sizes.


Bergquist Europe

European Headquarters
Postbus 276
1250 AG Laren - Netherlands -
tel: +31 35 538 0684
fax: +31 35 538 0295

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May 2012