Texas Instruments believes it has introduced the thinnest package for ICs. The company's PicoStar package is as thin as a human hair and will enable designers to save considerable board space with the option to embed silicon components in the PCB. The TPD2E007 is the first device in the family to be introduced in this thin package. It is a two-channel, back-to-back diode array that allows AC-coupled data transmission—for example as an audio interface—while maintaining signal integrity, says the company. The device can be surface-mounted or embedded into the board or connector. This differs from the conventional approach, where ESD protection is mounted close to the PCB's connector. The IC exceeds IEC61000-4-2 (level 4) ESD protection and can provide system-level ESD protection for internal ICs. The company claims that embedding the ESD solution in the board can save 80% of board space. With the reduced board space, equipment designers can add more components to a board—and therefore increase functionality. Board-level costs can also be reduced through embedding the device in the PCB, says the company. The initial device is available now in a four-pin tape-and-reel package. The lead finish is CuNiPd. More devices, such as the TPS62620, a low-power DC/DC converter, are sampling now and are due for production in the third quarter of this year.
