Infineon Technologies has introduced its smart family of IGBT (insulated-gate-bipolar-transistor) modules. The housing allows self-acting PressFIT technology to assemble a smart module to the PCB and to the heatsink in a single-step mounting process using one screw only. The modules enable power-converter-system solutions optimised for general-purpose and variable drives, uninterruptible power supplies, inductive heating and welding equipment, solar inverters and air-conditioning systems. The SmartPACK1 and SmartPIM1, which has an input rectifier and brake chopper, are the first members of the family and cover an inverter power range from approximately 2.2 to 11kW. Both modules are available for inverters up to 55kW. Further models are planned for up to 200A current distributed over different housing sizes.
