Laird Technologies has added three new products to its EMI Sentry form-in-place gasket family. This form-in-place gasket family provides EMI shielding while offering heat and humidity resistance, better adhesion strength, and a minimal compression set. These qualities improve reliability by increasing the durability and longevity of assemblies. In addition, fast handling and rapid curing speed up productivity, while increased softness offers the cost saving advantage of volume dispensing.
The three new gasket products are composed of designed pastes, which can be dispensed onto a metal or plastic substrate. SNC70-HXP consists of nickel/graphite-filled silicone that cures at HTV (high temperature vulcanisation). SNC70-RXP consists of nickel/graphite-filled silicone that cures at RTV (room temperature vulcanisation). SNN60-RXP consists of silver/nickel-filled silicone that cures at RTV (room temperature vulcanisation). The devices are suitable for handsets, base stations, military and consumer electronics markets.
