For device socketing and board-to-board interconnect, Advanced Interconnections has developed the Peel-A-Way removable terminal carriers, which suit applications that require low-profile and customisable PCB configurations. According to the company, the carrier reduces component height above the board by up to 80% compared to traditional moulded insulators. The 0.13mm polyimide film carrier uses near-flush solder-tail terminals to reduce the height. For board-to-board applications, standard spacing options range from 1.14 to 6.35mm with custom options available. In-house carrier stamping and precision drilling allow for zig-zag, off-pitch, special-radius, circular and custom patterns with multiple terminal and pin styles or cut-outs. The insulator can be left in place after soldering or removed for solder-joint visibility, inspection and test. Applications include socketing of relays, power devices, temperature and process—that is, flux—sensors, displays in automotive and aerospace, computers and peripherals, as well as industrial, instrumentation and test, medical, military and telecomms applications.
