Toshiba Electronics Europe has announced the availability of three bridge chips for use in mobile phones: the TC358740XBG, is a MIPI (Mobile Industry Processor Interface) camera serial interface to an MDDI (Mobile Display Digital Interface) chip, and the TC358760XBG and TC358761XBG are two MDDI-MIPI DSI (display serial interface) chips. The devices provide high-speed serial interfaces between a mobile phone's baseband or application processor and the phone's display or integrated camera, and are a requirement for high-resolution displays and cameras used in smartphones, mobile internet devices, netbooks, smartbooks, and other high-performance mobile devices. The TC358740XBG provides connectivity for MIPI cameras to baseband or application processors using an MDDI interface. The bridge chip supports MDDI 1.2 Type 2 on the host side. The device offers support for up to two cameras, with the primary camera using a MIPI link and the secondary camera using a MIPI link or parallel port. The TC358760XBG and TC358761XBG display bridges are optimised for mobile handsets using an MDDI high-speed serial digital packet host interface and provide connectivity of MIPI display panels to baseband or application processors using an MDDI interface. They are based on the MDDI 1.2 Type 1 and MIPI DSI 1.01 interfaces, but are backward-compatible with MDDI 1.1.
