Toshiba believes it has introduced the industry's highest capacity embedded NAND flash memory module with its 64Gbyte device. The chip is one of six embedded NAND flash memory modules complying with the JEDEC/MMCA Version 4.4 (V4.4) standard for the latest eMMC (embedded multimedia) cards with enhanced security features in smartphones, mobile phones, netbooks and digital video cameras. The module combines 16 32Gbit (equal to 4Gbyte) NAND chips fabricated with the company's 32nm process technology, and integrates a dedicated controller. The company claims it is the first to succeed in combining 16 32Gbit NAND chips, and applied advanced chip thinning and layering technologies for chips that are only 30mm thick. The company's single-package embedded NAND flash memories are available in densities from 2 to 64Gbyte. The 64Gbyte THGBM2G9DGFBAI2 is a 169-ball FBGA, measuring 14x18x1.4mm. The 32Gbyte THGBM2G8D8FBAIB measures 12x16x1.4mm. The 16Gbyte THGBM2G7D4FBAI9 is also in a 169-ball FBGA measuring 12x16x1.2mm. The THGBM2G5D1FBAI9 is a 4Gbyte version in the same package with the same dimensions. The THGBM2G4D1FBAI8 is a 2Gbyte capacity version in a 153-ball FBGA measuring 11.5x13x1.2mm.
