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Product Sub-group : Heat Sinks / Cooling Devices
New T-Clad® PA Simplifies Assembly
EPN Ad, May 2010, page 13 , # 39413
01/03/2010
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Reference: 39413

Peel & place thermal solution withstands the heat of solder reflow.

 

Easier assembly, cooler LEDs.

Bergquist’s T-Clad with pre-applied Bond-Ply®450 allows you to adhere your mounted LEDs to a variety of heatsinks and surfaces while thermally optimizing your application. This version of peel and place T-Clad can withstand the high temperatures of solder reflow during LED assembly and then be positioned in the lighting application using its strong thermally conductive adhesive

Bergquist Europe

European Headquarters
Postbus 276
1250 AG Laren - Netherlands -
tel: +31 35 538 0684
fax: +31 35 538 0295
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May 2012