Mill-Max offers grid horizontal Z-Bend sockets and receptacles, which are available in 0.050 and 0.100inch sizes. For low profile IO applications, these surface-mount SIP socket and header strips are assembled parallel to their board surface. They are suitable for placement near the board edge for easy access test connections and for creating pluggable adapter modules, which can sit perpendicular to the motherboard (mated to a vertical connector,) to conserve precious board real estate. The Series 310, 0.100inch Z-Bend sockets use MM #1023 receptacles that accept pin diameters from 0.015 to 0.025inch. These sockets are rated at 3A per pin position. Series 801, 0.100inch grid uses MM #1303 receptacles that accept pin diameters from 0.025 to 0.037inch and 0.025inch square leads. The sockets are rated at 4.5A per pin position. Series 850, 0.050inch Z-Bend headers are available with 0.016inch diameter solder tails and pluggable pins, using MM #4006-1 receptacles. Series 851 Z-Bend sockets use MM #4890-1 receptacles that accept pin diameters from 0.015 to 0.020inch. The headers are rated at 3A per pin position.
