TOP PRODUCTS

Orthodyne Electronics' High Density series wire bonders are designed to address the demand for small, thin and dense discrete power semiconductor packages such as SO8, PDFN, PQFN, DSO and DrMos.

The advanced leadframe handling and clamping capabilities of the HD series, in conjunction with the company's PowerRibbon technology, overcome interconnect challenges, while improving electrical performance, reliability and cost requirements.

The HD series includes the 7200HD dual-head semiconductor bonder and the 7600HD semiconductor bonder, available in one to four head configurations. Both systems can be equipped with large and small aluminium wire or PowerRibbon.