A thermally efficient gap filling material from Chomerics Europe combines enhanced heat conducting properties with the ability to conform to mating surfaces at low assembly pressures. The Therm-A-Gap HCS10 is available in sheet form and provides a cost-effective thermal management solution in applications such as desktop and laptop computers, telecomms equipment and automotive electronics modules. Available in thicknesses of between 0.5 and 5mm, the material can perform a dual thermal management and vibration dampening role. It is designed for use in assemblies with large tolerance stack-up problems or where heat generating components need to be coupled to a chassis or heatsink. Ease of use and strength of the new RoHS compliant material is enhanced by the inclusion of a smooth fibreglass reinforcement layer on one side. The high-tack upper surface of the material reduces contact resistance and also helps to simplify assembly. A deflection of 26% at an assembly pressure of 5psi makes the material suitable for use in equipment with delicate components or where low closure force snap together housings are used. The material has an operating temperature range of -55 to +200°C.
