Swissbit has added a 2GB DDR2 chip on board SODIM to its family of SDRAM memory modules. Built out of 1Gbyte DDR2 dies, the module is suited for industrial small form factor PCs. The chip on board technology directly attachs and wire-bonds the DRAM dies to the substrate and also covers the dies and bond wires with a protective epoxy encapsulent. With this process, the module becomes mechanically robust against shock and vibration, according to the company. Due to the direct die attachment, heat dissipation is enhanced via the substrate and socket and the extended surface. DRAM chips are kept at a low die temperature under limited airflow conditions and during increases in electrical performance. The memory module is available in industrial and commercial temperature grades.
