Tflex XS400 Series thermal gap filler the latest thermal pad in the Tflex thermal gap filler line from Laird Technologies provides moderate thermal performance with a thermal conductivity of 2.0W/mK. This soft interface pad conforms with minimal pressure, resulting in minimal thermal resistance at low pressure with little or no stress on mating parts. The thermal pad is available in thicknesses from 0.020 inch through 0.200 inch. The company states Tflex XS400 thermal material is suitable for easy assembly and no adhesive coating is required. Due to its Tgard liner on the other side, it is electrically insulating, stable from -40 to 160°C, and is certified to UL 94V0 flammability rating; complying with the limits of RoHS Directive 2002/95/EC and its subsequent amendments. The gap filler is an easy-to-handle thermal pad that possesses low outgassing properties, claims the company.
