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Power semiconductor devices reduce mounting area
08/10/2010
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Reference: 42226

Renesas Electronics has announced the development of the RJK0222DNS and RJK0223DNS, two power semiconductor devices with compact packages for use in DC/DC converters that provide power to the MCU/CPU, memory, and other circuit blocks of products such as servers and notebook PCs. The power semiconductor products each integrate a pair of power MOSFETs into a single package, enabling designs of DC/DC converters that are compact with high mounting density. The compact, low-loss power MOSFETs, fabricated using an advanced process, are contained in a package measuring 3.24.8×0.8mm, making it possible to reduce the mounting area by about half compared with previous power MOSFET products, and deliver efficiency of 95.2%, which contributes to reduced power consumption as claimed by the company. Information and telecommunication devices such as base stations, notebook PCs, servers, and graphics cards require multiple step-down DC/DC converters because they incorporate components, such as CPUs, GPUs, memory devices, and ASICs, which require a power supply voltage lower than that supplied by the battery. One main feature of the power semiconductor is that during the DC/DC converter's dead time, the fast current switching time from the power MOSFET to the Schottky barrier diode reduces power loss. In addition, it suppresses the spike voltage when the power MOSFET switches on, reducing the electromagnetic noise.


Renesas Electronics Europe

Dukes Meadow
Millboard Road
SL8 5FH Bourne End - United Kingdom -
tel: +44 1628 585 100
fax: +44 1628 585 900

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