Laird Technologies has announced the release of its rigid corner board-level shield. The board-level shield incorporates a corner design that optimises component rigidity for increased part and PCB (printed circuit board) firmness. As PCB designers are increasingly using thinner substrates, a rigid frame reinforces the assembly, thereby improving overall ruggedness and performance. The shield has improved solder joint reliability and resistance to solder joint fracture, especially in drop testing performance with thin PCBs, claims the company. It is also claimed that the shield is strong and robust, which results in coplanarity improvement of the solder castellations. The shield can tolerate deflection without plastic deformation. Elimination of drawn flange reduces the space needed on the PCB for shielding trace width by potentially around 0.3mm, allowing for the shield to be closely placed on the PCB. Elimination of draft allows for more undershield space and improved component clearance. The partially drawn corner is located near the top portion the shield, resulting in improved torsional rigidity with no drawn lip and no draft. For parts over 2mm, the corner is both drawn and formed with an interlocking multi-radius corner, which provides EMI shielding effectiveness. The interlocking corner can be meshed and closed in during the forming and drawing process for additional improved rigidity for parts taller than 2mm. For parts under 2mm, the entire corner is drawn without an interlocking corner.
