The GL865-DUAL from Telit Wireless Solutions is a GSM/GPRS module featuring LCC (leadless chip carrier) castellation packaging technology. Its small form factor, energy efficiency and low unit price make it suitable for mobile applications and for high-volume use across all industries, claims the company. Areas of application include medical monitoring equipment, miniaturised security systems and the tracking of people, animals and objects. These surface-mount package devices use metalised pads on the sides of the package. This kind of packaging is suitable for uncomplicated and low-cost applications based on four-layer PCB (printed circuit board). With the option for manual soldering and removal, it can also serve niche applications with a low volume production. For customers with integrated and complex applications, the company offers its family of m2m modules with BGA (Ball Grid Array) packaging. This is claimed to be particularly relevant for the automotive and telematics market. BGA is a packaging with one face covered with balls in a grid pattern and therefore, requires in comparison to the LCC castellation packaging smaller space. The BGA is also more efficient in regard of number of inputs and outputs. With its dimensions of 24.4x24.4x2.7mm and weight of 3.5g, the GSM/GPRS module offers GSM/GPRS functionality from a compact module. Its low unit price and inexpensive surface mount assembly allow it to be used in low-cost equipment. The GSM/GPRS module is an entry-level product aimed at EMEA and APAC markets. The GSM/GPRS module also features premium FOTA management, which enables radio-controlled firmware updates to be carried out. The use of RedBend’s vCurrent receptors means that product updates can be performed by transferring incremental updates. Built-in features such as the integrated TCP/IP protocol stack, a serial multiplexer and remote AT commands extend the application’s range of functions without incurring any additional costs.
