USB 3.0, with its plug-and-play ease of use, supports transfer rates of up to 5Gbit/s. However, the port design is sensitive to electrostatic discharge. A mere touch of the hand can induce an electric current, and the energy generated by the discharge can damage the equipment. The ESD3v3u4ulc damping diode from Infineon absorbs energy released through electrostatic discharge on a USB port to protect equipment from damage. The diode features low clamping voltage and low dnamic resistance of 0.23Ω. At 20kV, its ability to absorb energy exceeds the 8kV necessary to conform to the standard IEC 61000-4-2. The diode has minimal impact on the signal quality of the high-speed connection. The TSLP-9-1 package enables optimum PCB layouts, with a single diode protecting up to four traces simultaneously.
