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Product group : Digital ICs
Product Sub-group : Other Digital ICs
High-Speed CAN Devices
are for embedded networking applications
28/02/2011
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Reference: 43891

The LPC11C22 and LPC11C24 integrated high-speed CAN physical layer transceiver and microcontroller have been launched by NXP Semiconductors. The devices are on-chip CANopen drivers with integrated TJF1051 CAN transceiver to incorporate CAN functionality into a low-cost LQFP48 package. The CAN physical layer is designed for up to 1Mbit/s high-speed CAN networks and delivers enhanced ESD protection, improved electromagnetic compatibility and low power operation. The devices comply with the ISO 11898-2 standard for two-wire balanced signalling and is optimised for automotive sensor applications and rugged industrial CAN networks. High ESD handling capability on bus pins is combined with additional fail-safe features such as high DC handling capability on CAN pins, transmit data dominant time-out function, under-voltage detection, and thermal protection. Low power management is integrated, and the transceiver can disengage from the bus when it is not powered up. CANopen drivers are provided in on-chip ROM with easy-to-use APIs to adopt the devices into embedded networking applications based on the CANopen standard. Incorporating CANopen drivers in on-chip ROM reduces risk and effort while providing reduced operating power and secure and safe bootloading via CAN.


NXP Semiconductors

High Tech Campus 60
5656 AG Eindhoven - Netherlands -
tel: +31 31 40 27 25182
fax: +31 31 6 5176 0795

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May 2012