Aries Electronics has released the fine pitch bump adapters that convert TSSOP, QFP and other fine pitch devices to any other fine-pitch bumped package or routing configuration down to 0.4mm pitch. The adapters are mounted to the PCB via raised pads up to 0.010inch on the adapter bottom. They feature pads on the component side that accepts any device on any pitch and routes the signals for packages. The adapters can also add active or passive components to facilitate a complex or custom adaptation through the open space available at the top of the adapter board. They are 0.032inch thick FR4 or Rogers 370 HR, with 0.5oz. copper traces on both sides. The non-solder mask-defined pads are finished with electroless nickel immersion gold. The adapters are available in panelised form, as an adapter only, or as a turnkey solution.
