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Product Sub-group : Batteries & Battery Packages
Plastic packages with 0.3mm pitch suit smartphones and tablets
20/05/2011
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Reference: 44704

NXP Semiconductors has released logic plastic packages that measure 0.9x1.0x0.35mm with a pitch of 0.3mm. The SOT1115 and SOT1116 packaging design is suitable for portable handheld devices such as smartphones, tablets and SD cards. The company has carried out studies of mechanical failure modes of small logic packages and determined that lead-less plastic packages deliver good performance in terms of mechanical adherence to the PCB. The company's leadless packages have good contact area with the PCB, giving them good mechanical performance and robustness.


NXP Semiconductors

High Tech Campus 60
5656 AG Eindhoven - Netherlands -
tel: +31 31 40 27 25182
fax: +31 31 6 5176 0795
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May 2012