The Mill-Max 804 and 805 series interconnects are suitable for high pin count I/O and board-to- board applications. The triple row pin field allows dense packaging of signal connections. Also, placing and soldering one connector rather than three SIP sockets or a single and double row combination increases assembly efficiency and enhances positional accuracy. This triple row package on 2.54mm grid is available from 9 to 96 position configurations.
The connectors are RoHS compliant and feature high temperature thermoplastic insulators compatible with lead-free soldering temperature requirements. The receptacle shells of the 805 series socket pins are plated with 200u" pure matte tin. Hard gold plating, on both the 804 series header pins and the 805 series receptacle internal contacts, provides optimum conductivity and effective wear resistance, claims the company.
All the pin headers and receptacle sockets feature high-speed, screw-machined pins and receptacles. Each 805 series receptacle has a precision stamped beryllium copper Mill-Max #47 contact clip with a pin acceptance range of 0.64 to 0.94mm diameter or a 0.64mm square post and a current rating of 4.5A.
