Laird Technologies has introduced the Tpcm 580SP series phase change material that delivers a screen printable or stencilable TIM with a thermal conductivity of 4.0W/mK. The phase change material pad contains a solvent that assists in processing, which allows for wetting of the surface. After drying, the solvent becomes moisture-less to the touch, and therefore eliminates the mess associated with thermal grease, claims the company. Once the solvent is removed, the phase change material begins to soften and flow at temperatures around 45˚C. The material reduces thermal contact resistance by filling in the microscopic irregularities of the components it touches. It also minimises migration under thermal cycling from room temperature to chip device operating temperatures.
The phase change material series is available in a 0.5 or 1.0kg can for manual screen printing and large volume automatic operations. It is suitable for high frequency microprocessors, notebook PCs, desktop PCs, computer servers, DC/DC converters, memory modules, cache chips, insulated gate bipolar transistors, automotive and optical electronics.
