The XCede vertical backplane headers and right-angle daughter card receptacles from FCI are designed to deliver a performance of 25Gbit/s. Vertical backplane header configurations offer two, four or six differential signal pairs per column wafer with four, six or eight wafers per signal connector module. The vertical header range also includes options with two-, three-, or four-wall connector shrouds. Among the three-wall options are versions with integrated guide posts and polarisation key openings.
The company claims that the connector platform provides a migration path for customers designing equipment platforms. The use of advanced engineering polymers in a resonance-damping shield eliminates crosstalk resonances and enables low crosstalk across a wide frequency range.
The connectors also address requirements for higher linear signal density at the backplane or midplane interface. Connectors with six differential pairs per column fit 36mm minimum card slot pitch and provide 82.4 differential signal pairs per inch. Four-pair connectors provide 54.9 signal pairs per inch and can be used down to 25mm card slot pitch. Two-pair connectors fit on as little as 15mm slot pitch and support 27.5 signal pairs per inch along the card edge.
In addition to providing individual right-angle receptacle signal modules, customised groupings of right-angle signal, guidance and power modules can be attached to a single wafer organizer to form an integrated daughter card connector. The wide ground contacts in the vertical header feature a stiffening rib that extends near the tip of the contact.
