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The Honeycomb heat sink from Jaro Thermal is suitable for an array of cooling solutions for video cards, motherboards, and networking applications. It enables in directing heat towards the outside and produces a steady flow of cool air on the inside. The heat sink has a multi-holed design and optimises cross ventilation. It also simultaneously cools the surrounding ambient air. The heat sink's adhesive mounted version eliminates the need for mounting holes in the PC Board.

The heat sink can be used with either plastic or metal and ceramic ball grid array packages, depending on the thermal interface material. In addition, the thin size of the heat sink makes it suitable for real estate applications.