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Thermal gap filler material provides 2.7W/mK thermal conductivity
18/10/2011
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Reference: 45973

To help remove performance-killing heat from the complex, multi-level printed circuit board designs, Fujipoly has developed Sarcon GR-SL, a thermal gap filler material. When placed on top of uneven components, the material conforms to all gaps, peeks and air pockets making a level, large surface area contact point, says the company. The high degree of physical contact is claimed to allow the heat sink to remove unwanted heat.


As company's soft gap filler pad, this formulation provides a thermal conductivity of 2.7W/mK with a thermal resistance between 0.94 and 1.69°Cin2/W depending on sheet thickness. The V-0 tested filler material is available in 2.5 or 5mm thick sheets up to a maximum 200x300mm dimension and has an operating temperature of -40 to +150°C. 


Fujipoly Inc

900 Milik Street
PO Box 119
07008 Carteret - USA -New Jersey
tel: +1 732 969 0100
fax: +1 732 969 3311

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April 2012