To help remove performance-killing heat from the complex, multi-level printed circuit board designs, Fujipoly has developed Sarcon GR-SL, a thermal gap filler material. When placed on top of uneven components, the material conforms to all gaps, peeks and air pockets making a level, large surface area contact point, says the company. The high degree of physical contact is claimed to allow the heat sink to remove unwanted heat.
As company's soft gap filler pad, this formulation provides a thermal conductivity of 2.7W/mK with a thermal resistance between 0.94 and 1.69°Cin2/W depending on sheet thickness. The V-0 tested filler material is available in 2.5 or 5mm thick sheets up to a maximum 200x300mm dimension and has an operating temperature of -40 to +150°C.
