Fujipoly has announced a low resistance gap filler pad, the Sarcon 50G-Hm with low-tac top surface to alleviate the damage that can be done to a thermal gap filler pad during delicate assembly and re-work operations.
According to the company, the one-sided treatment is less sticky than the opposing surface allowing the thermal pad to adhere to either the target electrical component or opposing heat sink. This is claimed to allow for quick and easy removal without ripping, warping or damaging the interface material.
The filler pad transfers heat with a thermal conductivity of 6W/m°K and a low thermal resistance of 0.16°Cin2/W at 72.5psi (pounds per square inch). This 0.5mm thick, flame retardant TIM (thermal interface material) is available in sheets up to 300x200mm.
