Visitors to the Smart Systems Integration 2012 (21 - 22 March 2012) in Zurich, Switzerland, will be able to attend more than 60 presentations, 49 poster presentations as well as five keynote speeches from Honeywell, Empa, STMicroelectronics, Phonak Communications and the European Commission. The exhibition and conference is for MEMS, NEMS, ICs and electronic components and is in its sixth year. Conference themes system integration and packaging; assembling and interconnect technologies; design of components and systems; micro and nano devices and technologies; test and reliability of components and systems; new materials, nano structures and devices; manufacturing technologies; power management of smart systems/energy efficiency, energy harvesting; smart systems for communication and medtech and smart systems for automotive applications, green cars and aeronautics. Two EPoSS sessions and two US sessions, led by the MEMS Industry Group and Roger Grace Associates, will complete the programme. The MEMS Executive Congress Europe will take place on 20 March 2012 in the neighbouring Novotel. In the accompanying exhibition, research institutes, component and system manufacturers, suppliers and service providers in the micro and nanotechnology, sensors, wireless communications and microelectronic and micromechanics sectors will showcase products.
