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Compact, Half-Bridge Power Modules
are available with 3.4W/mk thermal interface material
19/01/2012
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Reference: 46737

Vincotech has added the flowPhase 0 power modules to its baseplate-less half-bridges ranging up to 1200V at 150A and 600V at 200A. The power modules enable downsizing of PCB design, selecting the optimum chipset, and making the PCB reusable, says the company. The company's portfolio of baseplate-less half-bridges encompasses the power modules ranging from 50 to 150A and 75 to 200A for 1200 and 600V, respectively. Alongside the standard types with low saturation voltage, the company also offers fast power modules with 1200V at 100A, which is said to feature optimised power flow and low-inductance with good EMI performance. The power modules are available in 66x33mm housings measuring 12 and 17mm in height, with a standard or an aluminum nitride direct copper bonded. They feature pre-applied thermal interface material with a conductivity of 3.4W/mK, that is said to ensure good thermal impedance.


VINCOTECH

Biberger Str. 93
82008 Unterhaching - Germany -

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May 2012