Richardson RFPD has availability and design support capabilities for the Xinger-III line of components from Anaren. The 3dB hybrid and directional couplers are the latest additions to Anaren's Xinger-brand of subminiature components for wireless infrastructure applications. When compared to equivalently-sized parts from the previous generation, the hybrid couplers offer 52-66% lower insertion loss (down to 0.12 dB), 5 times the power handling, 25-28% higher isolation, 63-71% better amplitude balance, and equal phase balance. The directional couplers offer 37-64% lower insertion loss (down to 0.05dB), 50% higher power handling, and equal directivity. The parts are available as an option to customers who want the smaller footprint and performance gains to keep pace with next generation base station equipment designs; previous generations of Xinger models are still in production and available. The components feature patent-pending design and materials advances. Their small footprint and robust power-handling capability make them viable alternatives to ceramic equivalents, avoiding the risk of cracked solder joints that ceramics can create when their thermal expansion characteristics do not match the PCB on which they are mounted. The Xinger-III components are softboard, so the co-efficient of thermal expansion (CTE) disparity is not an issue.
