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Rugged COM Express Module
withstands shock and extreme temperatures
25/04/2012
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Reference: 47752

For OEMs designing computing platforms into industrial equipment, the bCOM-L1200 rugged type 6 COM express module is by GE Intelligent Platforms.

A processor can be upgraded independently, as the carrier card is separate from the processor. An upgrade is a cost-effective way to extend the life of the sub-system. There is a range of five VIA Nano and VIA Eden processor options, with performance between 800MHz and 1.2GHz and power consumption between 3.5 and 13W. Up to 8Gbyte of DDR3 SDRAM can be configured, allowing the most demanding applications to be deployed, says the company. The company can support customers to develop their own carrier card configurations, or to provide custom carrier card variants on request. The module provides a Gigabit Ethernet port supporting transmissions of 10 and 100/1000 Mbit/s. There are also eight USB 2.0 ports, two serial ATA Interfaces with RAID 0 and 1 or port multiplier support. The SATA interfaces are ready for SATA II drives. For graphic performance there is an integrated analogue CRT and LVDS and two or three DDI ports. I/O functionality is provided through either three PCI Express x1 lanes or 1x 2+ 1x 1 lane, or a wide PCI Express x8/x4 port. The latter provides graphic and video capabilities. There is also an audio port and GPIO or SD-Card interface.


GE Intelligent Platforms

3/2 Great Michael House
14 Links Place
EH6 7EZ Edinburgh - United Kingdom -
tel: +44-(131)5613520
fax: +44-(131)5613521

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July 2012