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Delivered in the compact SP3 package, the IGBT 3-phrase bridge power modules from Microsemi are designed for motor-control applications. The module uses fast NPT IGBTs for 20 to 50kHz high-frequency applications and TFS (trench field stop) IGBTs for 5 to 20kHz low-frequency applications. All the modules feature integrated sensors to monitor the module-case temperature to detect over-temperature conditions. Current ratings are in the range of 30 to 50A for 600V and 15 to 25A for 1200V fast NPT IGBTs; they are 20 to 75A for 600V and 25 to 35A for 1200V TFS IGBTs. With a 12x40.8x73.4mm footprint, the SP3 isolated package provides a very compact power solution. In addition to the main DC-supply connections, these products offer extra DC-supply pins to connect a decoupling capacitor. Designed for industrial applications, these modules can be upgraded to withstand more severe environmental conditions. Aluminium nitride substrate can replace standard alumina for improved thermal performance. SiC diodes can replace FREDs for improved switching losses or increased operating frequency or temperature. An aluminium silicon carbide base plate can replace the standard copper base plate for reduced weight and extended lifetime when the module is exposed to wide temperature cycles. Packaging can be enhanced to withstand temperatures as low as -60°C.