The Open Base Station Architecture Initiative (OBSAI) was established by wireless OEMs - including LG, Nokia, and Samsung - to develop a set of specifications for the configuration and interconnect of BTSs (base transceiver stations) from a set of common modules (see Figure 1). The standardisation of the interfaces results in more fierce competition among silicon and solutions providers, which reduces the overall cost for equipment vendors and shortens time-to-market.
Figure 1: The OBSAI BTS architecture.
Internal interfaces between BTS functional blocks are designated as reference point 1 (RP1), reference point 2 (RP2) and reference point 3 (RP3). The RP1 specification includes control data and clock signals to all blocks. The RP2 specification specifies the user-data packets between the transport block and the baseband block, and the RP3 provides the specification for the user interface and signaling data between baseband block and RF block.
Figure 2: An example of the RP3-01 architecture.
The importance of the RP3 interface has increased with the advent of distributed base-station architectures and remote radio heads. These new networking topologies employ a single baseband block to control multiple RF blocks, both in point-to-point configurations as well as networked topologies. Figure 2 is an example of the architecture of a BTS with remote RF units (RRUs). To address these new configurations, the RP3-01 protocol specification, an extension to the RP3 protocol specification of the OBSAI family of specifications, was defined. It specifies support for several RRU topologies, including the aforementioned point-to-point connection between a BTS and an RRU, as well as chain, tree-and-branch and ring topologies. In addition to supporting data transfers to multiple RRUs, the RP3-01 extension also provides the capability to map RP1 control messages into the RP3 baseband link. This capability is critical in these newer configurations in order to minimise the number of connections needed for both data and control-message distribution.
Low-cost FPGAs implementing OBSAI
FPGA devices can play a key role in enabling the next generation of wireless equipment. As wireless protocols evolve and as requirements change, FPGAs provide a quick and flexible platform that allows faster time-to-market. These devices with SERDES allow for the easy implementation of multi-rate protocols, since the updated physical rates and the protocol logic required can be provided to the customer as a soft FPGA IP update. Constant infrastructure upgrades are part and parcel of the wireless-infrastructure market. Given their flexibility, FPGAs have always been popular for wireless implementation. However, their higher costs have made them less than optimal for cost-sensitive wireless designs. Until recently, equipment vendors that wanted to use FPGAs for wireless implementations had to select expensive high-end products because these were the only devices that offered the embedded SERDES needed to support the physical-layer requirements of the OBSAI specification. The net result was a higher total cost of implementation for the manufacturer. Consequently, these costly FPGA implementations were used only for prototyping; typically, the equipment vendor converted to an ASIC-based design for high-volume production. The recent introduction of low-cost FPGAs with embedded SERDES provides equipment designers with the flexibility that accelerates time-to-market and cost points for high-volume production.
The ECP2M SERDES-based FPGA supports the physical-link layer, the data-link layer and the transport layer of the OBSAI-RP3-01 specification. It also can handle the three standard bit rates of the OBSAI specification (768, 1536, and 3072 Mbit/s). Control and status parameters specifying core functionality are managed via bit-mapped I/O that may be hard-wired or interfaced to programmable registers. This provides users with optimal flexibility in defining static and/or dynamic management of the various functional parameters needed for their particular applications. A GUI-selectable option generates configurations based on their implementation requirements. An FPGA implementation with the OBSAI solution, divided into hard and soft IP as well as user-specific logic, is shown in Figure 3.
Figure.3: Partitioning of a OBSAI protocol stack.
Advantages of programmability
ASICs and ASSPs have always been popular for implementing complex functions at reasonable costs. However, the changing telecom marketplace has put a squeeze on equipment vendors and their ability to dedicate time and resources to develop ASIC solutions. ASSP vendors have also been hit hard during the most recent industry downturn, leaving fewer viable players in the marketplace. Also, open-industry specifications like CPRI and OBSAI have created a level playing field, since equipment designers can choose solutions from among a number of different sources. A key differentiator is in the flexibility of the available solution. FPGAs offer designers this flexibility, while also providing an upgrade path as industry specifications change or requirements are updated. For applications that involve emerging specifications, or where custom logic is desired, programmability is both a key advantage and a necessity for the designer. Programmability offers system designers the luxury to incorporate vendor-specific logic in the application layer, and at the same time provides the flexibility to provide multi-rate as well as newer standards as they evolve (or as existing standards are extended). The embedded hard-IP portion of the LatticeECP2M device offers performance and power advantages by implementing the fixed-logic function of the OBSAI specification in the physical layer, including integrated high-speed SERDES channels and encode/decode logic. There are many advantages to using a flexible, low-cost FPGA-based implementation. They include rapid time-to-market, the ability to accommodate changes in the specification without modifying hardware, and flexibility to implement differentiating features and integrate multiple functionalities onto one chip.