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Thermal-Interface Material
with impedance of 0.53°C-in²/W at 50 psi
19/02/2008
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Reference: 29506
The Bergquist Company announces the release of its latest Sil-Pad product, Sil-Pad 1200, a fiberglass-reinforced thermal-interface material featuring an optional adhesive coating. The material's smooth and non-tacky surface allows for efficient repositioning and ease of use. The material is supplied without a liner in dry form and on a carrier liner when supplied with optional adhesive coating. Exceptional thermal performance is exhibited at both low and high application pressures - thermal impedance is 0.53°C -in²/W at 50 psi -, making the product ideal for placement between electronic power devices and a heat sink in screw- and clip-mounted applications.

Bergquist Europe

European Headquarters
Postbus 276
1250 AG Laren - Netherlands -
tel: +31 35 538 0684
fax: +31 35 538 0295

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May 2012