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Thermal Putty Material
aimed at high-power devices
29/02/2008
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Reference: 29678

Fujipoly's GR-Pm thermal-interface putty is one of the most efficient methods for transferring heat from high-powered semiconductors or CPUs to nearby heat sinks and chassis walls. This advanced silicone-based material is very conformable and offers extremely low compression force at high compression rates - up to 90%. These inherent characteristics make it suitable for filling small air gaps and uneven mating services as small as 0.3mm. It complies with UL 94 V-0 flame-retardancy specifications and is available in sheets or die-cut forms up to 300x200mm. This product also offers a thermal conductivity of 6W/m°K with a thermal resistance ranging from 0.32 to 0.08°C"2/W.

 

 

 


Fujipoly Inc
900 Milik Street
PO Box 119
07008 Carteret - USA
tel: +1 732 969 0100
fax: +1 732 969 3311

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