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Product group : Digital ICs
Product Sub-group : ASICs, ASSPs and Gate Arrays
QuickLogic introduces low power programmable platform
13/03/2008
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Reference: 30163
QuickLogic has introduced a customer specific standard product (CSSP) platform for applications in mobile and portable products. PolarPro II extends the PolarPro low power programmable device concept with a more flexible I/O structure, increased responsiveness for its Very Low Power (VLP) standby mode, more configuration flexibility for the device's embedded SRAM, plus other new features to reduce PCB space and system bill-of-materials.

The new family builds on the PolarPro platform, offering a more compact architecture that allows for higher levels of integration in a single device. It is a suitable silicon platform for delivering customer- or market-specific combinations of QuickLogic's system blocks for storage, wired/wireless communication, video/imaging, security and other custom functions. PolarPro II also enables higher design flexibility. The I/O section, for instance, now offers eight independently-powered banks to simplify integration into multi-voltage systems, eliminating the need for costly level-shifting circuitry.

PolarPro II also adds a new power management scheme. The core voltage can now scale as low as 1.5V to reduce dynamic power consumption. The platform also offers a VLP mode that freezes device operation, during which the static current drops to less than 5 microamps. Entry and exit from the VLP mode can be done in 10 microseconds, allowing system developers to conserve energy by shutting the device down between bursts of activity.

The first platform in the PolarPro II family will begin sampling in April 2008, with other family members to follow. Device capacity will range up to 27 Customisable Building Blocks or CBBs, a size that allows users to use PolarPro II to extend a mobile product's capability with a large range of functions, such as high speed UARTs, SDIO interfaces, and CPRM security. The first platform will be available in a package size as small as 5x5 mm (TFBGA) for reduced board space and cost, as well as in good die configurations.


QuickLogic International Inc.

Suite 11, Hersham Place Technology Park,
Molesey Road
KT12 4RZ Hersham - United Kingdom -Surrey
tel: +44 1932-579011
fax: +44 1932-570121

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