Toshiba Corporation has launched 32Gbit embedded NAND Flash memory modules that feature high density and full compliance with the e-MMCTM(1) and eSDTM(2) standards. The embedded devices are designed for application in mobile digital consumer products, including mobile phones and video cameras. Samples will be available in September, and mass production will start in the fourth quarter. The new 32Gbit embedded devices combine eight 32Gbit NAND chips fabricated with Toshiba's 43nm process technology and also integrate a dedicated controller. Full compliance with JEDEC/MMCA Ver 4.3 and SDA Ver 2.0, high speed memory standards for memory cards as defined by the MultiMediaCard Association and SD Card Association, respectively, supports standard interfacing and simplified embedding in products, reducing development burden on product manufacturers. Toshiba offers a line-up of single-package embedded NAND Flash memories which includes a controller to manage basic control functions for NAND applications: LBA-NAND(3) memory, which has a NAND interface; eSD large capacity chips with SD interface; and e-MMC with an HS-MMC interface. This comprehensive line-up, available in densities ranging from 1Gbit to 32Gbit, supports application in a very wide range of products.
