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Hi-Flow Materials
suitable for heat dissipation
16/09/2008
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Reference: 33089

Bergquist has introduced the Hi-Flow 565U and Hi-Flow 565UT thermal conductive phase change materials. Both materials perform like thermal greases and can also be applied in pad form. The dry-to-touch Hi-Flow 565U and 565UT are provided in tabulation form for easy placement. These materials have a phase change temperature of 52ºC. The Hi-Flow materials offer thermal impedance of 0.04ºC-in2/W at 25 psi (565U) and 0.05ºC-in2/W (565UT). These unreinforced materials with 0.127mm and 0.254mm thickness are available in bulk roll form and as tabulated parts on a roll. The thermal management materials are used to dissipate heat.

Hall B5.267


Bergquist Europe

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May 2012