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Agilent Technologies has introduced a fast signal integrity circuit simulator for multigigabit, high-speed data link design. The Transient-Convolution Simulator, part of Agilent's Advanced Design System (ADS) EDA software platform, offers good simulation speed improvement for signal integrity simulations. The Transient-Convolution Simulator combines the ADS High Frequency SPICE, Convolution Simulator and related modules. Multicore processor support and a new, high-capacity sparse matrix solver allow signal integrity designers to perform fast "what-if" analyses to produce good designs.

The applications for the ADS Transient-Convolution Simulator are design and verification of chip-to-chip multigigabit/s serial links. The ADS Transient-Convolution Simulator can allow signal integrity engineers to address the physical phenomena such as impedance mismatch, reflections, electromagnetic coupling, crosstalk and microwave frequency attenuation by performing "what-if" design space exploration. This process uses a circuit-level model that can be verified against measured data and electromagnetic artwork to arrive at an optimum design while avoiding costly and time consuming prototype iterations.