Integrated Silicon Solution has introduced a complete line of copper-leadframe
memories, including SRAM, DRAM and EEPROM devices. The use of copper leadframes can enhance the long-term reliability of these devices in harsh environments such as automotive-engine controls and industrial applications. Copper features good thermal conductivity, translating into better heat dissipation from the die into the leadframe and out of the package. This results in less heat stress inside the component, which improves the reliability of the device. The coefficient of thermal expansion in a copper leadframe closely matches that of the pads on the printed-circuit board. As a result, less stress is applied to the solder joints due to the similar expansion and contraction rates of the adjoining materials during the temperature swings experienced in harsh environments.
