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A high-efficiency, low-noise, integrated DC/DC module from Intersil, the ISL8201M,  saves space in a thermally enhanced QFN package. The package includes the PWM controller, MOSFET drivers, power MOSFETs and inductor, and an optimised compensation circuit. It simplifies power-supply design as only input and output capacitors and a resistor are needed to implement a complete power solution, says the company. The module can reduce procurement and placement costs in telecoms, data comms, electronic data processing, wireless network systems, medical and instrumentation, and distributed bus-architecture-based point-of-load applications. An onboard input filter supports- ultra-low noise operation, reducing EMI. Efficiency is up to 93%, and the QFN package is designed to offer an optimum heat transfer through the PCB. A large copper plate under the package allows the module to achieve a power density of approximately 200W/inch3 - approximately four times that of conventional open-frame modules - thereby eliminating the need for heat sinks. Other features include internal soft-start, auto-recovery overcurrent protection, an enable-pin option and pre-biased output start-up capability. The high integration and performance of the ISL8201M is provided in a QFN package that measures 15x15x3.5mm.