(30/08/2010)
Laird Technologies has introduced the Cascade series of TEAs (Thermoelectric Assemblies). The series comprises custom designed cooling assemblies that use multistage TEMs (Thermoelectric Modules) for high temperature differential ...
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(18/08/2010)
Orion Fans has introduced a line of wire mesh, plastic, louvered, push-on, metal and filtered fan guards and kits, providing design engineers multiple guard options when evaluating fans for their specific applications. Whether the...
More about Fan guard and kits feature welded joints and flame-resistant rating |
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(09/06/2010)
10inch AC fans from Orion are designed specifically to move a large amount of air through confined spaces. The OA254 fans measure 254x89mm and feature airflow of 547 CFM on the standard model and up to 850 CFM on the XC model. The...
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(27/05/2010)
For the thinner, modified TO220 housings with reduced base plate thickenesses, Fischer Elektronik offers specially designed heatsinks which can be attached by pushing them into the TO220 housing. The FK 252 series is available in ...
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(03/05/2010)
Along With A Complete Line Of Standard Heatsinks; Radian Offers Custom Heatpipe Heatsinks And Designs We Offer Complementary Engineering Analysis For Standard And The Most Difficult Applications...
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(08/03/2010)
High power modules require safe and efficient heat dissipation to achieve trouble-free operation and a long service life. For thermal dissipation from high power modules, such as IGBT, Fischer Elektronik has developed various liqu...
More about Range of Liquid Coolers |
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(05/03/2010)
Fischer Elektronik offers liquid coolers for power modules. The enhanced performance of modern high-power modules, which are used in industrial applications such as drive engineering and frequency converters as well as in photovol...
More about 6000W liquid coolers ensure safe heat dissipation |
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(01/03/2010)
Peel & place thermal solution withstands the heat of solder reflow. Easier assembly, cooler LEDs. Bergquist’s T-Clad with pre-applied Bond-Ply®450 allows you to adhere your mounted LEDs to a variety of heatsinks and surfaces whi...
More about New T-Clad® PA Simplifies Assembly |
(04/02/2010)
Lohmeier offers DTI/DTS 6000 series side-mount cooling units. The units consume up to 43% less energy than the DTI/DTS 9000 line. The improved EER (energy efficiency ratio) is achieved by means of EC technology-based fans and an o...
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(04/01/2010)
• Complementary thermal design and support.• Optimizing your thermal package.• CFD evaluation on custom designs.• Complete in house test lab.• Standard off the shelf products....
More about Active or Passive Heatsinks; our thermal engineers are here to help! |
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(04/12/2009)
Rittal has introduced a 2kW cooling unit. The units have been developed using the new EC fan technology and incorporate the nano-coated condenser and condensate management as standard.The new cool efficiency label, in accordance w...
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(30/11/2009)
DC fans for electronic enclosures, telecommunications and networking equipment are now available from Orion Fans. The VA series fans are claimed to maximise airflow in nearly sealed, high-static-pressure environments. According to...
More about Optimal-Airflow Fan Series |
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(30/11/2009)
Aluminium enclosures from DEM Manufacturing are claimed to provide the highest possible standard of protection against dust and water and will withstand prolonged immersion in water. They are suitable for systems exposed to the mo...
More about Aluminium-Enclosure Range |
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(19/11/2009)
Cool Innovations has introduced a line of powerful integrated fansinks. They are composed of a pin fan heat sink and a fan that is embedded into the heatsink's pin array. According to the company, the configuration allows for low-...
More about Slim Integrated Fansinks |
(17/11/2009)
Zircotec has developed the ZircoFlex, a flexible ceramic heat-shield material that is supplied in the form of a roll. The foil offers efficient heat protection in a range of applications, including internal computer components suc...
More about Flexible Ceramic Material |
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(22/09/2009)
Mouser Electronics has signed a distribution agreement with Conflux, a developer and manufacturer of new technology for heating products such as the SIP compound and the ZPZ design.The Conflux product line features new technology ...
More about New heating technology allows cost-effective and efficient heating |
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(18/09/2009)
New silicone thermal gel sheets from Advanced Antivibration Components (AAC) feature better control and dissipation of heat in electronic components. These gel sheets are suitable for applications that include computer internal co...
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(03/08/2009)
Laird Technologies has introduced a series of air-to-air outdoor thermoelectric cooler assemblies. This series is modified to be suitable for a number of outdoor applications, such as telecomm battery back-up systems, outdoor kios...
More about Thermoelectric cooler assemblies increase cooling in outdoor applications |
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(30/07/2009)
Fischer has developed a range of aluminium heatsinks to dissipate the heat from HP (high power)/HB (high brightness) LEDs. These heatsinks are offered with different diameters and contours and are available in different lengths to...
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(19/06/2009)
Fischer Elektronik has developed the ICK-SMD series of aluminium heatsinks. The heatsinks dissipate heat from SMDs (surface-mounted devices). The dimensions of the heatsinks match a large range of current IC case designs. The low ...
More about Fischer develops aluminium heatsinks |
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(21/05/2009)
AMS Technologies has introduced Webra water and air coolers for converters. For a variety of converters and inverters in wind power, traction and industry applications, Webra provides customised cooling solutions - among which are...
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