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Product group : Mechanical Components,Subassemblies,Enclosure
Product Sub-group : Heat Sinks / Cooling Devices

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	Machined Heatsink Profiles from Fischer Elektronik (07/05/2008) ... More
	Ultra-Thin Flexible Heaters (05/04/2008) Featuring a micro-thin wire-heating element in between optical-grade polyester sheets, the Minco Thermal-Clear heaters provide reliable uniform or profiled heat patterns without blocking light. They are suitable for heating LCDs, ... More
	Heatsink Products (05/04/2008) The reliable functioning of electronic subassemblies in EMC applications is sometimes compromised thermally, as closed casings cannot easily ensure heat dissipation from the electronics devices inside. Fischer Elektronik is able t... More
1200W Compact Cooling Package (04/04/2008) The CCP Compact Cooling Package is an efficient cooling method for dissipating the heat losses generated by MicroTCA systems. An air/water heat-exchanger module with a fan unit ensures controlled climate management and a cooling o... More
	Minco’s 384-hole flexible heater ensures temperature uniformity (02/04/2008) Minco European Headquarters has launched the 384-hole heater, which provides critical temperature uniformity across a 384 well polymerase chain reaction (PCR) sample block. These heaters strive to provide an alternative for steel ... More
	High-End Heat Sinks (02/04/2008) The Seifert range of heat-sink products is now available from Live Electronics. As well as standard components, custom sinks can also be quickly and cost-effectively manufactured to suit individual applications. Designed to delive... More
	Heat-Spreader Substrate (18/03/2008) Providing solid-state-lighting design engineers with a means of dissipating heat in visible LED applications, Optek has developed a thermally conductive aluminium substrate. Designated the OptoTherm OCB201 series, this heat spread... More
	High-Performance Heat Sinks (05/03/2008) Schaffner is now able to offer its customers the Seifert range of high-efficiency heat-sink products. This extensive range of thermal-management solutions encompasses single-component PCB-mounted heat sinks; high-performance, fan-... More
	Thermal Laminate (05/03/2008) Laird Technologies has announces the launch of the T-Lam SS LLD, a metal core printed-circuit-board laminate for LED applications. This innovative environmentally friendly laminate is designed to keep bright and ultra-bright LED-l... More
	Thermal Putty Material (29/02/2008) Fujipoly's GR-Pm thermal-interface putty is one of the most efficient methods for transferring heat from high-powered semiconductors or CPUs to nearby heat sinks and chassis walls. This advanced silicone-based material is very con... More
Silicone-Based Materials (19/02/2008) Made from fully FDA (the US Food and Drug Administration body) approved materials, the Bisco series of cellular silicones, which are produced by UK-based manufacturer Kemtron, are suitable for sealing, cushioning, vibration-isolat... More
Phase-Change Material (19/02/2008) With a total thermal resistance 0.010oC-in2/W at 50 psi, the T-pcm 580S is a high-performance thermal-phase-change material designed to meet the reliability and price requirements of the most demanding of industry applications. Th... More
	MOSFET Cooler Product (19/02/2008) The HR-09S MOSFET cooling system with its patented adjustable-length design aims to expand engineers' system-life expectancy and create a stable condition not only during normal operation, but also when the frequency and voltage a... More
	Thermal-Interface Material (19/02/2008) The Bergquist Company announces the release of its latest Sil-Pad product, Sil-Pad 1200, a fiberglass-reinforced thermal-interface material featuring an optional adhesive coating. The material's smooth and non-tacky surface allows... More
	High-Performance Heatsink (19/02/2008) Alpha has expanded its wide range of off-the-shelf products to meet with customers' increasingly varied requirements. The UB13070 heat sink has dimensions of 130x70mm (with heights of 15, 20, 25 and 30mm) and has been designed for... More
PCB heatsinks from Fischer Elektronik (18/11/2007) Versatile versions, best heat dissipation, compact design, quick and easy mountingCustomer-specific types, modifications and special designExtruded heatsinks with solder pinspressed-in solder pins for direct solder-in mounting, sp... More
	High-Capacity Heat Exchanger (26/10/2007) For applications exceeding 2000W levels, thermal-management-solution provider Thermacore has developed a high-capacity cross-flow heat exchanger, the HXc. Based upon the use of highly effective, cross-flow plate heat cores, the HX... More
	Composite Material (16/10/2007) AlSiC (Aluminum Silicon Carbide) is a metal matrix composite that enables cost-effective integration of cooling-pin fins for high-power applications. This matrix enables the cost-effective integration of cooling-pin fins for high-... More
	High-Performance Heat Sinks (13/10/2007) The MSA DIN45-1 is a DIN-mountable, single-SSR heat-sink product offering that is produced by New England-based thermal-management solutions firm Anacon Power. It features a 50W maximum power rating and can transfer heat out of sy... More
Heat-Sink Enclosure (09/10/2007) The LHSK is a free-standing or 3U rack-mount enclosure that is produced by combining two interlocking channels with end panels. Eurocard circuit boards (100x160mm) can slide into internal card guides, enabling power devices to be ... More
High-Efficiency Heat Sink (08/10/2007) The Cold-Cube series of high-efficiency heatsink solutions from HS Marston is designed to fit within the standard U2 rack-mounting systems. It consists of two types of products - the CC001 and CC002 - both of which are readily ava... More
	Thermal-Interface Material (06/10/2007) Sarcon XR-v is a newly formulated silicone thermal-interface material that offers the installation flexibility of a thin, putty-like sheet and the performance of a high-end gap-filler pad. The product provides a thermal conductivi... More
Heat-Sink Solutions (02/10/2007) Greenstone's range of aluminum-extruded heat sinks offer users the ability to extrude and fabricate optimised thermal-management solutions under one roof, thereby reducing cost and lead time. They can be provided in a variety of p... More
Soft Thermally Conductive Gap Fillers (01/08/2007) The Therm-a-Gap 569 and 579 are ultra-soft thermal gap-filler materials which offer increased conformability when compared to current alternative thermal-management solutions. The manufacturer claims that within the 3 W/mK thermal... More
	Custom Fan-Tray Assemblies (23/07/2007) The OAXXX series, standard AC fan trays are available in 3-, 6- and 9-fan configurations, in 110VAC, 220VAC or dual-voltage designs. The company will also produce custom fan-tray assemblies to meet custom specifications. The assem... More