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This category includes cabinets, racks, enclosures and shielding as well as microwave assemblies

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Product group : Mechanical Components,Subassemblies,Enclosure
Product Sub-group : Heat Sinks / Cooling Devices

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	New T-Clad® PA Simplifies Assembly (01/03/2010) Peel & place thermal solution withstands the heat of solder reflow. Easier assembly, cooler LEDs. Bergquist’s T-Clad with pre-applied Bond-Ply®450 allows you to adhere your mounted LEDs to a variety of heatsinks and surfaces whi... More about New T-Clad® PA Simplifies Assembly
	Hi-Flow Materials (16/09/2008) Bergquist has introduced the Hi-Flow 565U and Hi-Flow 565UT thermal conductive phase change materials. Both materials perform like thermal greases and can also be applied in pad form. The dry-to-touch Hi-Flow 565U and 565UT are pr... More about Hi-Flow Materials
	Thermal Challenge: VRM - Solution: New Bergquist S-Class Gap Pad®5000S35 (06/05/2008) ... More about Thermal Challenge: VRM - Solution: New Bergquist S-Class Gap Pad®5000S35
	Thermal-Interface Material (19/02/2008) The Bergquist Company announces the release of its latest Sil-Pad product, Sil-Pad 1200, a fiberglass-reinforced thermal-interface material featuring an optional adhesive coating. The material's smooth and non-tacky surface allows... More about Thermal-Interface Material
	Thermal Management Material (01/05/2005) The Sil-Pad 1500ST (Soft Tack) electrically insulating thermal interface material is functional at contact pressures as low as 69 kN/m2 (10 psi). Sil-Pad 1500ST is inherently tacky on both sides, allowing it to be automatically di... More about Thermal Management Material