TOP PRODUCTS

Texas Instruments has introduced the TPS75005, an integrated power circuit for the company's C2000 real-time control, 32bit microcontrollers and other DSP and FPGA processors. The circuit comes in a thermally enhanced 5x5mm QFN pa... More about QFN packaged, Integrated Power Circuit

In addition to the standard densities of 8, 16 and 32Gbyte, Micron Technology has introduced a 64Gbyte LRDIMM (load-reduced dual inline memory module) to meet the density requirements of servers. The low-power memory modules can h... More about Memory modules enable high data frequencies and memory capacity

A single level cell (SLC) NAND flash memory from Toshiba Electronics Europe has an embedded error correction code (ECC). BENAND can be used in LCD TVs, digital cameras and industrial applications such as robots. Until now, the ECC... More about SLC NAND Flash Memory

STMicroelectronics has extended its family of RFID and NFC wireless memory ICs with a 16kbit energy-harvesting wireless memory, the M24LR16E. The company's dual-interface memories feature a low power I2C interface operating at 400... More about 16kbit Wireless Memory

ARM has announced the ARM Mali-T658 GPU for superphones, smartphones, tablets, smart-TVs and automotive infotainment solutions. It enables a raft of use cases outside of traditional graphics processing, including computational pho... More about GPU compute leadership for superphones, smartphones, tablets, and smart-TVs

Microsemi has announced a DDR3 SDRAM memory device and is available as a compact x64 and x72 unregistered dual in-line memory module or small outline dual in-line memory module. The memory module provides up to 4Gbyte compact memo... More about Memory module streamlines I/O routing

Samsung Electronics has announced that it has developed DDR3 RDIMMs (registered dual inline memory modules) designed for use in low-power enterprise server systems at 1.25V. In case of a 1.25V 16Gbyte RDIMM, the module consumes on... More about Registered Dual Inline Memory Modules

Tripling the programming speed of competing serial flash memories, the 65nm FL-S NOR flash memory is available from Spansion. The company claims that it is also 20% faster than DDR read speeds. Memories in the family range from 12... More about Increased Speed NOR Flash Memory

Swissbit has announced the 4Gbyte DDR2 SODIMM as an addition to its Industrial family of SDRAM memory modules. The module, with dimensions of 67.6x30mm, is built with 16, 256Mx8 DRAMs. It contains Winbond 2Gbyte DRAM components ba... More about 2Gbyte SDRAM Memory Modules

Crucial will make available LRDIMMs (load-reduced dual inline memory modules) in support of the forthcoming Intel Xeon processor E5 family. The modules will support higher memory densities than standard DDR3 RDIMMs and can add mor... More about Load-Reduced Memory Modules

Samsung Electronics has announced volume production of SSDs (solid state drives) that support the SATA revision 3.0 interface with data transmissions at 6Gbit/s. The PM830 SSDs are available at 512, 256 and 128Gbyte densities. The... More about Solid state drives for OEM notebooks and tablets

Crucial has introduced the 8Gbyte DDR3-1333MHz UDIMM (unregistered dual in-line memory module) for desktop and SODIMM (small outline-DIMM) for laptop memory modules to support the latest second generation Intel Core i7 and i5 proc... More about Desktop and laptop memory modules suit portable form factors

Micron Technology has introduced the 1Gbyte, 512 and 256Mbyte N25Q high-density SPI NOR memory in both 1.8 and 3V power supply voltages. The flash memory features multiple I/O protocol with single SPI, DSPI (dual SPI), and QSPI (q... More about High-Density SPI NOR Flash Memory

Samsung Electronics has announced the development of 32Gbyte DDR3 RDIMMs (registered dual inline memory modules) that use 3D TSV (through-silicon via) package technology. The package technology is based on the company's 30nm-class... More about 30nm Dual Inline Memory Modules

Three versions of MoBL (More Battery Life) asynchronous SRAMs have been released by Cypress. The 128-, 64- and 32Mbit memories have 32-bit bus widths and are designed for telecomms, computers, peripherals, and consumer, medical an... More about Low Power Asynchronous SRAMs

Fujitsu Semiconductor has developed SPI (serial peripheral interface) FRAMs (ferroelectric RAMs) based on the 0.18µm technology. FRAM combines the advantages of swift writing SRAM with non-volatile flash. The MB85RSxxx SPI FRAM fa... More about Three Ferroelectric RAMs

STMicroelectronics has launched a 2Mbit serial EEPROM chip that is suitable for write-intensive applications. The company claims that the M95MO2 IC allows designers to replace multiple EEPROMs with a single device. The IC is suita... More about EEPROM chip in SO8N package suits write-intensive applications

Samsung Electronics has started manufacturing the toggle DDR 2.0 MLC (multi-level-cell) memory chip that features a 64Gbyte density. The company claims that the chip is designed to support the requirements of mobile devices such a... More about Memory chip supports requirements of smartphones and tablets

STMicroelectronics has introduced a memory module with a recording feature that stores important data in less than 1ms and recovers system data when a sudden power failure occurs. The M35B32 EEPROM is used in the black-box recorde... More about EEPROM for Medical Devices

Micron Technology announced the availability of the third-generation RLDRAM 3 memory (reduced latency DRAM)for networking applications such as high-end routers and switches. The memory technology is a suitable choice for 40 and 10... More about Memory technology offers maximum data rates of 2133Mbit/s

Micron Technology has introduced a series of solid-state drives that are suitable for data-intensive enterprise applications including cloud computing, high-performance computing, data analytics, business intelligence, and video o... More about Solid-State Drive Series

Cypress Semiconductor has introduced a range of FIFO memories with maximum densities of 72Mbit. The high-density FIFOs are suitable for video and imaging applications which require high density and high frequency for effective buf... More about FIFO Memories in Three Densities

Crucial has introduced DDR3-1066MHz very low profile registered dual in-line memory modules that are used in blade servers and to run memory intensive applications such as server virtualisation. With a PCB height of 18.75mm, the f... More about Registered Dual In-Line Memory Modules

The ATAES132 series of EEPROM device from Atmel offer secure data storage by using the AES (advanced encryption standard) authentication for industrial, consumer, computing and embedded applications. The security features are avai... More about EEPROM device offers advanced encryption standard authentication