(10/01/2012)
In addition to the standard densities of 8, 16 and 32Gbyte, Micron Technology has introduced a 64Gbyte LRDIMM (load-reduced dual inline memory module) to meet the density requirements of servers. The low-power memory modules can h...
More about Memory modules enable high data frequencies and memory capacity |
|
(03/01/2012)
STMicroelectronics has extended its family of RFID and NFC wireless memory ICs with a 16kbit energy-harvesting wireless memory, the M24LR16E. The company's dual-interface memories feature a low power I2C interface operating at 400...
More about 16kbit Wireless Memory |
(27/12/2011)
Microsemi has announced a DDR3 SDRAM memory device and is available as a compact x64 and x72 unregistered dual in-line memory module or small outline dual in-line memory module. The memory module provides up to 4Gbyte compact memo...
More about Memory module streamlines I/O routing |
|
(02/11/2011)
Samsung Electronics has announced that it has developed DDR3 RDIMMs (registered dual inline memory modules) designed for use in low-power enterprise server systems at 1.25V. In case of a 1.25V 16Gbyte RDIMM, the module consumes on...
More about Registered Dual Inline Memory Modules |
|
(31/10/2011)
Swissbit has announced the 4Gbyte DDR2 SODIMM as an addition to its Industrial family of SDRAM memory modules. The module, with dimensions of 67.6x30mm, is built with 16, 256Mx8 DRAMs. It contains Winbond 2Gbyte DRAM components ba...
More about 2Gbyte SDRAM Memory Modules |
(24/10/2011)
Crucial will make available LRDIMMs (load-reduced dual inline memory modules) in support of the forthcoming Intel Xeon processor E5 family. The modules will support higher memory densities than standard DDR3 RDIMMs and can add mor...
More about Load-Reduced Memory Modules |
(26/09/2011)
Crucial has introduced the 8Gbyte DDR3-1333MHz UDIMM (unregistered dual in-line memory module) for desktop and SODIMM (small outline-DIMM) for laptop memory modules to support the latest second generation Intel Core i7 and i5 proc...
More about Desktop and laptop memory modules suit portable form factors |
(05/09/2011)
Samsung Electronics has announced the development of 32Gbyte DDR3 RDIMMs (registered dual inline memory modules) that use 3D TSV (through-silicon via) package technology. The package technology is based on the company's 30nm-class...
More about 30nm Dual Inline Memory Modules |
(07/07/2011)
Samsung Electronics has started manufacturing the toggle DDR 2.0 MLC (multi-level-cell) memory chip that features a 64Gbyte density. The company claims that the chip is designed to support the requirements of mobile devices such a...
More about Memory chip supports requirements of smartphones and tablets |
|
(23/06/2011)
Micron Technology has introduced a series of solid-state drives that are suitable for data-intensive enterprise applications including cloud computing, high-performance computing, data analytics, business intelligence, and video o...
More about Solid-State Drive Series |
|
(22/06/2011)
Cypress Semiconductor has introduced a range of FIFO memories with maximum densities of 72Mbit. The high-density FIFOs are suitable for video and imaging applications which require high density and high frequency for effective buf...
More about FIFO Memories in Three Densities |
|
(13/06/2011)
Crucial has introduced DDR3-1066MHz very low profile registered dual in-line memory modules that are used in blade servers and to run memory intensive applications such as server virtualisation. With a PCB height of 18.75mm, the f...
More about Registered Dual In-Line Memory Modules |
(03/05/2011)
Datakey Electronics' RUGGEDrive series of portable memory solutions offers data storage and transfer capabilities of USB flash drives and SD cards in a secure package. The memory solutions are constructed using a solid over-mouldi...
More about Portable memory solutions offer data storage capability in secure package |
(03/05/2011)
Designed with the aim of helping SoC designers take advantage of the performance gains of the DDR4 memory standard, Cadence Design Systems has announced DDR4 technology. The EDA company claims that DDR4 is an important memory cont...
More about SDRAM Memory Technology |
|
(04/02/2011)
Swissbit will present its industrial DRAM modules in chip on board and surface mount technology, available in DRAM, SDRAM, DDR, DDR2 and DDR3 technology. The Flash industrial products include CompactFlash, CFast serial flash, mult...
More about Industrial Storage DRAM |
(04/11/2010)
MIPS Technologies has claimed to have introduced a processor that offers enhanced speed for synthesisable multicore IP. The company further claims with the MIPS32 1074K CPS (Coherent Processing System), users can obtain high perfo...
More about Coherent processing system features MIPS architecture |
(14/10/2010)
The X-200 series of industrial 2.5inch SSD (solid state drive) from Swissbit supports a Serial ATA (SATA II-3Gbit/s) interface and is claimed to offer an array of valuable features. Because SSDs have no moving parts, vibration and...
More about SATA 2.5inch SSDs feature improved shock tolerance |
|
(06/09/2010)
Samsung is mass-producing what it claims is the industry's first 2Gbit Green DDR3 memory, using 30nm technology. It is intended to deliver high performance, low power consumption in PC and server applications designed to capitalis...
More about 2Gbit DDR3 Memory |
(31/03/2010)
Arasan Chip Systems has made available a portfolio of memory card controller IP cores and corresponding software stacks. The IP supports the Secure Digital (SD or SDIO 3.0), Multimedia Card (e.MMC 4.4), Memory Stick (MSPro, MSPro-...
More about Memory Card Controller IP Cores |
|
(25/03/2010)
Taiwanese NAND flash storage device manufacturer, APRO has launched the BON serial ATA II SSDs (solid state drives) in a ruggedised 2.5inch form factor. The company claims that it offers the highest capacity SATA II SLC (single le...
More about NAND Flash Solid State Drive |
|
(01/03/2010)
As demand for memory becomes more focused on higher densities, single packages and smaller chip sizes, you need cutting edge, reliable technology from the industry leaders. Toshiba’s line up of MLC NAND products includes the world...
More about Advanced Nand Technology From Toshiba |
|
(25/01/2010)
Swissbit has released DDR3 unbuffered ECC ULP (ultra low profile) DIMMs, its new family of high-speed/high performance SDRAM memory modules. These 240pin, 72bit modules are designed for high-density memory applications for embedde...
More about ULP DIMMs support error detection and correction |
|
(29/10/2009)
Swissbit has released the DDR3 ULP (ultra low profile) RDIMM (Registered ECC DIMM) high-speed/high performance SDRAM memory module. It is suitable for high-density memory applications for embedded, industrial, communication and ne...
More about SDRAM memory module suits high-density memory applications |
|
(08/10/2009)
Swissbit has released its high-speed SDRAM memory module, the DDR3 ULP (ultra low profile) RDIMM (registered DIMM), which has been designed to satisfy high-density-memory applications for embedded, industrial, communication and ne...
More about SDRAM Memory Module |
(21/08/2009)
TSMC has unveiled a commercial 65nm MTP (multi-time-programmable) non-volatile-memory process technology, which incorporates process-qualified MTP IP blocks jointly developed with Virage Logic. The new technology is the first 2.5V...
More about Multi-Time Programmable NVM |