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(23/01/2012)
Claimed to provide improved thermal measurement and advanced connectivity, the SC8400 and SC6500 thermal imaging cameras are from FLIR Systems. Equipped with a cooled Indium Antimonide (InSb) detector that produces 1280x1024 pixel...
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(09/01/2012)
Designed to be attached to a robotic arm, the Macro Sensors miniature CD 375 LVDT linear position sensors detect position change and provides an analogue voltage signal, proportional to the amount of motion, to a controller. The c...
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(12/12/2011)
A high-performance Lexan EXL co-polymer resin from SABIC addresses the fast-moving trend toward miniaturisation of PV (photovoltaic) connectors and junction boxes. The enhanced electrical and flame-retardant performance of the res...
More about High Performance Co-Polymer Resin |
(07/12/2011)
A green coloured, heat-cured finish from Vacuumschmelze protects VAC permanent rare earth magnets in extreme conditions of up to 250°C. The VacCoat 30033 adhesive coating and corrosion protection finish can be used at temperatures...
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(14/11/2011)
Norplex-Micarta has introduced the WaveMax 8000, an woven glass fabric combined with a static dissipative epoxy resin. The solder pallet material offers good mechanical strength at continuous operating temperature over 180ºC. Acco...
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(18/10/2011)
To help remove performance-killing heat from the complex, multi-level printed circuit board designs, Fujipoly has developed Sarcon GR-SL, a thermal gap filler material. When placed on top of uneven components, the material conform...
More about Thermal gap filler material provides 2.7W/mK thermal conductivity |
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(10/10/2011)
Preforms in the Uni-form epoxy range from Multi-Seals have low outgassing properties. The company claims that unlike many adhesives, the highly cross-linked, pre-shaped thermoplastics release minimal amounts of trapped gasses or c...
More about Pre-Shaped Epoxy Pre-Forms |
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(05/09/2011)
Thermal management is critical to heatsink performance which can be tested with Thermex temperature distribution film from Sensor Products. The economical, thin sensor film can be used as a design and assembly quality control chec...
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(02/09/2011)
Rakon's RGX series uses proprietary technology enabling the crystal to withstand acceleration of up to 30,000g with minimal parameter change. The patented design ensures shock survivability and vibration performance and g-sensitiv...
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(10/08/2011)
Vishay Intertechnology has released two miniature SMD quartz crystals with frequency ranges from 12 to 25MHz. The XT23 and XT35 quartz crystals offer ceramic packages that measure 3.2x2.5 and 5x3.2mm, respectively. Both quartz cry...
More about Ultra-Miniature Quartz Crystals |
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(02/06/2011)
A range of Nylon spacers and washers that are designed to grip the outside of a screw shank has been launched by Keystone Electronics. The retaining spacers and washers have specially configured inside diameters to grip screw shan...
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(01/06/2011)
Laird Technologies has introduced the Tpcm 580SP series phase change material that delivers a screen printable or stencilable TIM with a thermal conductivity of 4.0W/mK. The phase change material pad contains a solvent that assist...
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(25/02/2011)
Christopher Associates has introduced the S3X-BF70M and 200N series wafer bumping pastes exhibiting a high definition over time and at elevated temperatures. There are various ways to form solder deposits on wafers. Printing solde...
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(23/02/2011)
Würth Elektronik believes it can help attach ICs to a densely populated circuit board with the ESC (encapsulated solder connection) process. The process is suitable for the most diverse substrates, says the company, citing example...
More about Substrates for Flip Chips |
(02/02/2011)
In-system programmers from Algocraft support micrcontrollers from Freescale, Infineon, Microchip, NXP, Renesas, STMicroelectronics and TI; memories from Atmel, Holtek, ISSI, Microchip, Numony, oN, Ramtron, Sano, SII, spansion, SST...
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(02/02/2011)
Fischer Elektronik has extended its range of tube cases, with specially shaped tube profiles to install front foils and membrane keyboards. The tube cases have integral guide slots to accommodate non-standard PCBs. The standard ve...
More about Tube Cases |
(24/01/2011)
KSW Microtec has showcased its products in secure prelaminate technologies for high-end access control and security in eGovernment, ePayment and eTicketing, at Cartes and IDentification 2010 in Paris, on December 2010. The mobile ...
More about Products featuring secure prelaminate technologies for highly secure applications |
(11/01/2011)
Specialty Coating Systems states that potting capabilities are available on the SCS Precisioncoat spray coating and dispense system. The system dispenses potting materials, including silicones, epoxies, and urethanes, in a variety...
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(06/01/2011)
KSW Microtec has received MasterCard certification for its Thinlam prelaminate. The laminate is designed for high security applications in the fields of eBanking and eGovernment. The certification enabled the company to offer a ne...
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(10/12/2010)
Rhodia has introduced a halogen-free range of flame retarded Technyl polyamides, dedicated to photovoltaic component applications. The polyamides offer a solution that meets the technical, processing, regulatory and cost-performa...
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(15/11/2010)
Chomerics Europe's thermal management and EMI shielding products, including shielded windows for automotive, medical, telecomms and military. As electronics technology has evolved, the company has developed materials to meet the n...
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(17/09/2010)
Kemtron will be exhibiting its range of RFI/EMI shielding gaskets and components at Munich. The range includes elastomers, silicon and fluoro silicons loaded with conductive particles such as silver plated copper, silver plated al...
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(24/06/2010)
A thermally efficient gap filling material from Chomerics Europe combines enhanced heat conducting properties with the ability to conform to mating surfaces at low assembly pressures. The Therm-A-Gap HCS10 is available in sheet fo...
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(09/06/2010)
Orthodyne Electronics' High Density series wire bonders are designed to address the demand for small, thin and dense discrete power semiconductor packages such as SO8, PDFN, PQFN, DSO and DrMos.The advanced leadframe handling and ...
More about Wire bonders offer high reliability |
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(09/06/2010)
Multi-Seals has introduced a line of Uni-form epoxy preforms with low outgassing properties. These cross-linked, pre-shaped thermoplastics release minimal amounts of trapped gasses or condensable material under vacuum conditions a...
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