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Product group : Production Equipment & Materials
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	Removable Terminal Carriers (17/11/2009) For device socketing and board-to-board interconnect, Advanced Interconnections has developed the Peel-A-Way removable terminal carriers, which suit applications that require low-profile and customisable PCB configurations. Accord... More
	Elettric 80 demonstrates automation solutions at Drinktec fair (02/09/2009) Elettric 80 is demonstrating its automation solutions at the Drinktec fair in Munich on September 2009. A complete, fully operational, end-of-line chain will be built, and during the fair visitors will be able to follow the demons... More
	ACI-ecotec introduces an automatic contacting system (18/06/2009) ACI-ecotec has developed an automatic contacting system, the ecoContact, which requires less than 40s to manufacture a thin-film PV (photovoltaic) module completely. The system offers high speed and high contact quality. This flex... More
Two Grades Of Polymer (29/05/2009) Victrex Polymer Solutions has added the ST polymer to its Peek range. This polymer has been designed to perform specifically in applications requiring a combination of high temperature, high mechanical performance and high dimensi... More
	Packaging Is Thermo-Formed (29/05/2009) 3M claims that it has produced the world's first one-piece packaging system that provides impact absorption, eliminating the need for additional packaging materials. Protective Packaging eliminates the need for other packaging par... More
	Stopping And Motion Analyser (28/05/2009) The SMART stopping- and motion-analyser tool, developed by the Swedish company Jokab Safety, is a diagnostic tool for maintenance, adjustments, trouble-shooting and stopping-time measurements of machines. The values are read—and t... More
	Fischer introduces a series of hexagonal spacing sleeves (22/05/2009) Fischer Elektronik has developed a series of hexagonal spacing sleeves made of plastic. The series combines the benefits of low weight and mechanical stability given by metallic threads. The thread inserts are made of brass and ar... More
	DEK launches stencil solution for fine-pitch printing (26/03/2009) DEK has launched its VectorGuard Platinum stencil technology. The VectorGuard Platinum is an enabling stencil platform suitable for advanced applications such as wafer level packaging, direct chip attach, flip chip and ball grid a... More
	Polymer Moulding (20/02/2009) Lightweight, compact and highly chemically resistant electromagnetic flow-sensors from Aichi Tokei Denki in Japan use Victrex Peek polymer that allow for a hollow design, alleviating the need for any movable parts or obstacles to ... More
	Chomerics unleashes soft EMI gasket (04/02/2009) Chomerics Europe, a division of Parker Hannifin, has introduced a soft, moulded elastomer EMI shielding gasket. The CHO-SEAL 1270 EMI shielding gasket is suitable for use in designs where high mechanical performance, good electric... More
	Modern & Super-Slim Fanless Touch Panel Computers For Kiosk, DSA, HMI, FA, machine marker & building automation (03/02/2009) ... More
	IMEC introduces an integrated micro-mirror array (02/02/2009) IMEC has presented a monolithically integrated 11Mpixel micro-mirror array for high-end industrial applications. Each mirror in the array is 8x8μm and can be individually tilted by the high-speed integrated CMOS circuitry undernea... More
	Bergquist introduces power LED thermal substrates (27/01/2009) The Bergquist Company has introduced ready-to-use Thermal-Clad insulated metal substrates (IMS) in standard star, square, array or strip formats. Ten different contact patterns are available, supporting high-power LEDs from Osram,... More
EMI-Shielding Gasket (18/11/2008) The low-closure-force EMI-shielding gasket Soft-Shield 4850 is now available in strip form from Chomerics Europe. The strip, already avaiable in sheet form, is an EMI-shielding gasket that uses multi-planar, Z-axis conductive-foam... More
Cobalt-iron Alloy (02/10/2008) Vacuumschmelze presents its new alloy Vacoflux 18HR. It is the successor to Vacoflux 17, originally designed for diesel injection applications, and has been significantly improved to comply with the requirements of increasingly hi... More
	PCB Production Line (25/09/2008) Christian Enzmann has achieved a milestone with the successful mass production start of its new Stripping, Etching and Stripping (SES) line. The process-optimized SES line by Occleppo allowed Enzmann to significantly improve the r... More
	SMD Assembly System (22/09/2008) Essemtec will be showing a flexible SMD assembly system, the new automatic pick and place FLX2011. In addition to the pick and place head, this system can be equipped with up to two dispensing systems. The system also can mount no... More
	Zero Halogen Initiative (09/08/2008) Cookson Electronics is launching the Zero Halogen Initiative for ALPHA branded products to assist electronics assemblers in selecting materials that have either zero halogen content or only trace levels, based on published industr... More
	Line Scan Camera (01/08/2008) The Basler runner GigE Vision colour line scan camera has displayed good performance while running at unusually slow speeds. It performs well in applications with minimum line rates of 1 Hz up to 100 Hz. The Basler ruL2098-10gc tr... More
Low-Cost Cleaner (01/08/2008) Fujikura Europe has launched a low cost, disposable cleaning tool, which will allow easier cleaning of connectors and receptacles in the backplane. The cleaner accommodates SC, ST and FC connector types, and an additional tool is ... More
	Embossing Tool Techniques (01/08/2008) Tecan launches techniques to produce embossing tools, from which manufacturers can produce high-resolution prototype and mass-production parts. Tecan can replicate originals produced in photoresist, etched silicon, glass and diamo... More
Fujikura launches the FSM-60S fusion splicer (28/04/2008) Fujikura Europe has launched the FSM-60S fusion splicer - the next generation to the FSM-50S. The new splicer targets the European telecommunications market. The new machine is smaller and lighter than its predecessor, and offers ... More
	TMD develops 150 kV gridded electron gun (23/04/2008) A gridded electron gun operating at 150kV and 10A has been developed by TMD Technologies. The device is a high voltage shadow gridded design. The design has a low emittance beam and the cathode is magnetically immersed, making the... More
	Essemtec enhances its SMT placement equipment FLX series (22/04/2008) Essemtec has enhanced its SMT placement equipment FLX series, enabling faster and more precise functioning of machines in the series FLX2011, FLX2021 und FLX2031. The FLX series of placement machines provide large feeder capacity ... More
Liquid Gap-Filling Material (08/04/2008) Gap Filler 1500 is a two-part, high performance, thermally conductive liquid gap-filling material that features superior slump resistance and high shear-thinning characteristics for optimised consistency and control during dispens... More